I hope to engage and connect with the conference attendees that are searching for positive results to their FOWLP device issues.
Livermore, CA (PRWEB)
May 05, 2017
Yield Engineering Systems, Inc. (YES) announced today that their Chief Executive Officer, Bill Moffat, will be a panelist during The ConFab at the Hotel del Coronado in San Diego, California being held May 14-17, 2017. Moffat will join the Advanced Packaging panel discussion taking place on Monday, May 15, 2017 at 2:05 pm. Panelists and participants will delve into the discussion of fan-out/fan-in, wafer-level /panel-level, 2.5D/3D, glass/PCB, and materials/manufacturing technologies.
The ConFab is a conference and networking event for the semiconductor manufacturing and design industry decision-makers and influencers. The ConFab brings suppliers together with leaders at IC manufacturing companies, foundries, fabless companies, packaging houses or OSATs, as well as suppliers of MEMS and other types of electronics.
YES manufactures a wide variety of processing equipment including dielectric vacuum cure ovens to assist Fan-Out Wafer Level Packaging (FOWLP) engineers with polyimide cure, PBO cure, BCB cure and low temp polymers curing.
Bill Moffat, Founder and CEO of YES said, “I hope to engage and connect with the conference attendees that are searching for positive results to their FOWLP device issues. Through collaborating with customers and their processes using our YES-VertaCure and YES-450PB Series ovens, YES has developed solutions over the years that are critical to the success of FOWLP. I’m looking forward to sharing my insights on the topic.”
For more information regarding YES ovens, visit http://www.yieldengineering.com or contact them…